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Colloids and Interfaces Journal: Food Colloids III

Special Issue title: Food Colloids III

 

Dear Colleagues,

Food colloids comprise nowadays a unique biological and technological platform to address one of the major challenges of modern society such as the development of healthier and more sustainable processed food products. Several scientific areas converge in the rational design of these products which relies ultimately upon a deep knowledge of the molecular, physicochemical, interfacial and colloidal properties of food ingredients, their interactions and the dynamics of the systems. Food ingredients comprise principally proteins, surfactants, lipids and polysaccharides while the range of colloidal structures present in food products is extremely vast and constantly expanding (foams, emulsions, gels, particles, micelles etc.). Increasing nutrient bioavailability, reducing fat intake, controlling food digestibility, and gut health etc. are some of the challenges faced by current research in food colloids. Furthermore, advances in physicochemical and microbial effects in relation to colloidal systems and their applications in food processing and packaging can have a great impact on food quality, safety and nutrition.

This Third Special issue is a collection of original works presented in the 19th  Food Colloids Conference: Using Colloid Science to Find New Sustainable Solutions in Food organized by the International Hellenic University on 14 -18 April 2024, in Thessaloniki, Greece.

This Special Issue, in alignment with the 19th Food Colloids Conference, in addition to the multidisciplinary approach on food colloids outlined above gives a special focus on sustainability where colloids provide clean, environmentally friendly, plant-based solutions.

Guest Editors

Prof. Dr. Eleni P. Kalogianni
Department of Food Science and Technology, School of Geotechnical Sciences, International Hellenic University, Sindos, Greece
Interests: lipids, interfacial properties, food science and technology
Website

 

Dr. Julia Maldonado-Valderrama
Biocolloid and Fluid Physics Group, Department of Applied Physics, University of Granada, Granada, Spain
Interests: Surface tension, interfacial rheology, monolayer, foams, emulsions, Atomic Force Microscopy, food science, digestion, colloids
Website

 

 

Dr. Reinhard Miller
Institute for Condensed Matter Physics, Technical University Darmstadt, Darmstadt, Germany
Interests: Dynamics and mechanics of liquid interfaces; thermodynamics of adsorption of surfactants and proteins; interfacial interactions and 2D rheology; stability of foams and emulsions
Website

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Colloids and Interfaces is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI’s English editing service prior to publication or during author revisions.

Submission opens at 20/04/2024 ends at 20/12/2024

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